INTERNATIONAL JOURNAL OF ENGINEERING, SCIENCE AND - Volume 6, Issue 8,, December 2017 (Special Issue)

Pages: 638-644

Date of Publication: 24-Dec-2017

Print Article   Download XML  Download PDF

Buckling Analysis on Thin FilmsMechanical-Thermal Coupled-Field Using Theorotical Calculations

Author: Dasari Gowri Sankar* Dharmala Venkata Padmaja**

Category: Engineering, Science and Mathematics

Abstract:

Devices with feature size on the order of one micrometer have found wide spread applications in science and engineering. MEMS, is a rapidly growing technology for the fabrication of miniature devices which provides a way to integrate mechanical, fluidic, optical, and electronic functionality on very small devices, ranging from 0.1 microns to one millimeter. Recently, it has been proposed that regular patterns can be generated through the mechanical buckling of a thin film. The process of buckling of thin compressed films deposited

on polymethylmethacrylate (PMMA) Vs Structral Steel compared under mechanical and thermal loadings has been investigated utilizing an optical microscope. Particularly, thermal cycling analysis on thin film/substrate system under compression has been characterized to discuss the thermal property of PMMA and Structral substrate validate through Therotical Calculations.

Keywords: Mechanical Buckling Thin Flims Miniature Device